ONLINE SURVEY – WAVEGUIDES ABOVE 110 GHz
The IEEE is currently developing a standard for metallic waveguides and their interfaces for frequencies of 110 GHz and above. The IEEE Working Group (P1785) that is developing the standard has recently chosen a 'Preferred Scheme' for defining the frequency bands and waveguide dimensions and is now inviting comments on this scheme. Details of the scheme can be found at: http://grouper.ieee.org/groups/1785/status_detail.html, which includes a link to an online survey that has been set up to capture any comments. Please take a few minutes to read about this activity, at the above website, and respond by using the survey. Alternatively, comments can also be sent directly to me, at: nick.ridler@ieee.org. Comments should be sent before May 20, 2010, since the P1785 Working Group will make a final decision on whether to accept the Preferred Scheme soon after this date.
IMS MTT-S 2010 Reception for Women in Microwaves (WIM)
Networking Opportunity for Females in the Industry Attending IMS 2010
The IEEE IMS / MTT-S 2010 organizing committee invites all women working in the high-technology field who will be at IMS MTT-S 2010 in Anaheim, California the week of May 24, 2010 to attend the Women in Microwaves (WIM) Reception. The WIM reception is set for Tuesday evening, May 25, 2010 from 5:30pm -7:30 p.m. at the Uva Bar (outdoor patio) in Downtown Disney,
Both women and men who are attending IMS are welcome to attend, share a glass of wine, and make new connections to the growing community of women whose careers involve high technology.
For more information on this social networking event, please visit http://www.ims2010.org/women_in_mw.html.
Space is limited so kindly RSVP to WIM@IMS2010.org to secure your place at this event.
IEEE Transactions on Antennas and Propagation and Microwave Theory and Techniques Special Issue on Multiple-Input Multiple-Output (MIMO) Technology
Multiple-input multiple-output (MIMO) wireless techniques represent a breakthrough in the use of antenna arrays in wireless systems. Unlike traditional phased array or diversity techniques that improve the sensitivity to one signal of interest, MIMO systems employ antenna arrays jointly at transmit and receive to spatially multiplex signals over multipath or near-field channels. Measuring system performance in terms of channel capacity, MIMO systems offer the exciting possibility of linear capacity increase with additional antennas compared to more modest logarithmic growth of traditional diversity systems. The large potential of MIMO techniques is evidenced by rapid adoption into recent wireless standards, such as 802.11n, LTE, and WiMAX.
Although MIMO systems offer impressive possibilities, the paradigm shift to multiple independent channels presents new questions and challenges to the RF community. For example, modified performance metrics and methodologies for array design are required to provide explicit goals for near-optimal design. Novel circuit and device designs are needed that yield peak capacity, coupled with multi-channel transceiver architectures with high sensitivity, low power consumption, and minimal cost. The interplay between various MIMO modes and the impact on the circuit requirements is also of interest. Characterization and modeling of the propagation channel should adequately capture the spatial environment and antenna effects, yet provide simple enough descriptions for efficient link-level simulation. Developments in MIMO also warrant revisiting applications such as relay systems, radar, physical-layer security, and cross-layer design, where detailed knowledge of propagation physics now becomes more critical.
The focus of this special issue is on recent developments in antennas, propagation and microwave related aspects of MIMO technology, including fundamental theory, new modeling and design methodologies, and novel applications. This Special Issue is a joint activity of the Antennas and Propagation and Microwave Theory and Techniques Societies. It will be published in the Transactions on Antennas and Propagation. Manuscripts should therefore conform to the requirements for regular papers of this Transactions as specified in the information for Authors in the inside back cover of a recent issue or on the web site (http://ieeeaps.org/aps_trans/index.htm). Potential contributors may contact one of the Guest Editors by email (with the contact information provided below) to determine the suitability of their contribution to the special issue. All papers must be submitted online through the AP Transactions Manuscript Central web site (http://mc.manuscriptcentral.com/tap-ieee), with a statement to the Editor-in-Chief of the AP Transactions, Dr. Trevor S. Bird, that they are intended for this special issue.
Paper Submission Deadline: June 1, 2010
Publication Date: June 2011
CFP: 19th IEEE International Conference on Electrical Performance of Electronic Packaging and Systems
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and CAD/design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society.
Deadline: July 16, 2010, 8pm, PST
For more information, visit the conference web site at www.epeps.org
