Survey on IEEE role in THz Science and Applications
You are invited to complete a six-question survey on the role of the IEEE in THz Science and Applications at the URL below.
http://www.surveymonkey.com/
s.aspx?sm=ctjirdIzM8Ywm05VkCen3Q_3d_3d
CFP: 2010 IEEE Radio Frequency Integrated Circuits Symposium
The 2010 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2010) will be held in Anaheim, California on May 23-25, 2010. For the latest information, visit: www.rfic2010.org
Electronic Paper Submission/Communication: Technical papers must be submitted via the RFIC 2010 web site at www.rfic2010.org. The deadline is January 5, 2010. Hard copies will not be accepted. Complete information on how and when to submit a paper will be posted on the RFIC 2010 web site.
Technical Areas: Papers are solicited describing original work in RFIC design, system engineering, system simulation, design methodology, RFIC circuits, fabrication, testing and packaging to support RF applications in areas such as, but not limited to:
- Cellular System IC's and Architectures: GMSK/8PSK, CDMA, 3/4 G, Wi-MAX, GPS.
- Wireless Data System IC's and Architectures: Bluetooth, 802.1x, Telemetry, RFID.
- Wide Band System IC's: UWB, MMDS, CATV, Optical System, Backplane.
- Small-Signal Circuits: LNA's, Mixer's, VGA's, Active Filters, Modulators.
- Large-Signal Circuits: Power Amplifiers, Drivers, Advanced TX circuits, Linearization.
- Frequency Generation Circuits: VCO's, PLL's, Synthesizers.
- RFIC Device Technologies: IC Technologies, Si, MEMs, SOI, GaAs.
- RFIC Testing: Packaging, Modules, Embedded Testing.
- Modeling and CAD: RFIC Modeling, Characterization of Active and Passive Devices.
- Si Millimeter Wave IC's: Circuits (PA, Mixer, LNA) and Systems (Vehicular, Medical).
Technical Format: The technical sessions will be held for three days from Sunday through Tuesday. Workshops will be on Sunday. Several invited sessions and talks will take place during the conference.
Microwave Week 2010: The RFIC 2010 will be in conjunction with the IEEE MTT-S International Microwave Symposium (IMS). Microwave Week 2010 will continue with the International Microwave Symposium and Exhibition, and the Microwave Historical Exhibit.
The MTT-S Undergraduate/Pre-Graduate Scholarship Application DEADLINE Nov 1, 2009! is extended to November 15, 2009
The purpose of the scholarship program is to attract undergraduates to the microwave and RF discipline, and to encourage them to pursue graduate degrees in the field.
Highlights:
- The IEEE Microwave Theory and Techniques Society (MTT-S) will award up to ten $1500 undergraduate/pre-graduate scholarships for Spring 2009.
- The applicant must be an undergraduate student in electrical engineering (or related field) at the time of application, and should be enrolled full-time in his/her final year of the undergraduate program, first year of graduate studies, or combined B.S./M.S. program during the 2008-2009 academic year.
- The student must identify a faculty mentor who will supervise the applicant's project or thesis work in the microwave/RF area. Alternatively, project work may be conducted in conjunction with industry, but a faculty mentor must still be identified.
- Applicant must be an IEEE student member, and the faculty mentor must be an IEEE MTT-S member.
- There are no citizenship requirements. Awards will be distributed globally based on society membership. Awards are limited to one per faculty mentor.
- Funds may be used for project materials and/or stipends.
- Awardees are also encouraged to attend an MTT-S sponsored conference. Travel expenses are partially reimbursed (over and above the $1500 award).
Questions may be directed to: drayton@umn.edu
